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2020-2025 Global Ball Grid Array (BGA) Package Market Report - Production and Consumption Professional Analysis (Impact of COVID-19)

2020-2025 Global Ball Grid Array (BGA) Package Market Report -...

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2020-2025 Global Ball Grid Array (BGA) Package Market Report - Production and Consumption Professional Analysis (Impact of COVID-19)
2020-2025 Global Ball Grid Array...
Report Code
RO9/125/29705

Publish Date
16/Feb/2021

Pages
111
PRICE
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A Ball Grid Array or BGA package is a form of surface mount technology, or SMT package that is being used increasingly for integrated circuits.. The Ball Grid Array, BGA, uses a different approach to the connections to that used for more conventional surface mount connections. Other packages such as the quad flat pack, QFP, used the sides of the package for the connections.
This report elaborates the market size, market characteristics, and market growth of the Ball Grid Array (BGA) Package industry, and breaks down according to the type, application, and consumption area of Ball Grid Array (BGA) Package. The report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.

In Chapter 3.4 of the report, the impact of the COVID-19 outbreak on the industry was fully assessed. Fully risk assessment and industry recommendations were made for Ball Grid Array (BGA) Package in a special period. This chapter also compares the markets of Pre COVID-19 and Post COVID-19.
In addition, chapters 8-12 consider the impact of COVID-19 on the regional economy.

Key players in the global Ball Grid Array (BGA) Package market covered in Chapter 13:
NexLogic Technologies
Texas Instruments
Palomar Technologies
Micro Systems Technologies
Advanced Interconnections Corp
Sonix
Intel

In Chapter 6, on the basis of types, the Ball Grid Array (BGA) Package market from 2015 to 2025 is primarily split into:
Common BGA package
Flip Chip BGA Package

In Chapter 7, on the basis of applications, the Ball Grid Array (BGA) Package market from 2015 to 2025 covers:
Electronic products
automotive
communications
aerospace

Geographically, the detailed analysis of production, trade of the following countries is covered in Chapter 4.2, 5:
United States
Europe
China
Japan
India

Geographically, the detailed analysis of consumption, revenue, market share and growth rate of the following regions are covered in Chapter 8, 9, 10, 11, 12:
North America (Covered in Chapter 8)
United States
Canada
Mexico
Europe (Covered in Chapter 9)
Germany
UK
France
Italy
Spain
Others
Asia-Pacific (Covered in Chapter 10)
China
Japan
India
South Korea
Southeast Asia
Others
Middle East and Africa (Covered in Chapter 11)
Saudi Arabia
UAE
South Africa
Others
South America (Covered in Chapter 12)
Brazil
Others

Years considered for this report:
Historical Years: 2015-2019
Base Year: 2019
Estimated Year: 2020
Forecast Period: 2020-2025

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