As the global economy recovers in 2021 and the supply of the industrial chain improves, the MEMS packaging market will undergo major changes. The global MEMS packaging market is projected to grow at a CAGR of 17.8% during the forecast period (2022- 2027). Owing to the increase in global demand for smart automotive solutions, the need for the MEMS packaging market is expected to go up. The increasing demand for connected devices and consumer electronics is expected to drive the market for sensors. Additionally, the global industrial sensor usage is soaring due to the ever-increasing applications of sensors, driving the demand for MEMs devices.
The global MEMS packaging industry report provides top-notch qualitative and quantitative information including: Market size (2017-2021 value and 2022 forecast). The report also contains descriptions of key players, including key financial indicators and market competitive pressure analysis.
The report also assesses key opportunities in the market and outlines the factors that are and will drive the growth of the industry. Taking into account previous growth patterns, growth drivers, and current and future trends, we also forecast the overall growth of the global MEMS packaging market during the next few years. The global MEMS packaging market size will reach USD million in 2028, growing at a CAGR of % during the analysis period.
The MEMS packaging market can be split based on product types, major applications, and important regions as follows:
ChipMos Technologies Inc.
AAC Technologies Holdings Inc.
Bosch Sensortec GmbH
Infineon Technologies AG
Analog Devices, Inc.